Tag Archives: embedded package-on-package

Samsung Announces Mass Production Of High-Density ePoP Memory For Smartphones

Samsung Electronics Co., Ltd., a world-leading producer of advanced memory technology devices, is announcing that it has begun mass production of the industry’s first ePoP (embedded package on package) memory. This is a single memory package with 3GB of LPDDR3 (low power double data rate 3), 32GB of eMMC (embedded multi-media card) and a controller. Samsung’s latest ePoP is designed …

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