MOSAID First to Achieve Single Channel Full Performance 16-Die NAND Flash Stack

MOSAID Technologies Inc. announces that it is sampling the industrys first NAND Flash MCP (multi-chip package) with a 16-die NAND stack operating on a single high-performance channel.

MOSAIDs 512Gb HLNAND (HyperLink NAND) MCP combines a stack of 16 standard 32Gb NAND Flash die with two HLNAND devices to achieve 333MB/s output over a single byte-wide HLNAND interface channel.

Imagine 1TB capacity Solid State Drives (SSDs) with a single controller chip!

Conventional NAND Flash MCP designs cannot stack more than four NAND dies without suffering from performance degradation, and would require two or more channels to deliver similar throughput.  Mosaid utilizes its own HyperLink memory technology combined with standard NAND flash cell technology to delivery the industry’s most advance feature set.  This technology is able to reach sustained I/O bandwidths more than ten times higher than conventional Flash.

According to Jin-Ki Kim, Vice President of R&D, MOSAID,  The 16-die stack 512Gb HLNAND MCP demonstrates the superior scalability of HLNANDs ring architecture compared to the parallel bus architecture used in industry standard NAND Flash products. HLNANDs ring architecture allows a virtually unlimited number of NAND die to be connected on a single channel without performance degradation.

Peter Gillingham, Mosaid’s Vice President and Chief Technology Officer, states HLNAND confers distinct performance and form factor advantages.  Using HLNAND technology, system engineers can design Gigabyte per second bandwidth and Terabyte capacity Solid State Drives (SSDs) with a single controller chip. Competing designs utilizing industry standard NAND MCPs will require multiple controller chips.



  • 2 HLNAND interface die and 16 32Gb NAND die
  • I/O data rate: 333MB/s (DDR333) at 1.8V
  • Low power operation “ no termination resistors required
  • Simultaneous read and write data transactions at full data rate for 667MB/s aggregate data throughput
  • Fully independent LUN (logical unit number) operation
  • Package: 100-ball BGA (ball grid array) measuring 18mm x 14mm.

blankThe development and deployment of this technology will further accelerate the current trend toward SSD utilization in enterprise environments. The difference in cost per GB of HDD storage versus SSD storage continues to shrink, and this technology could push it past the tipping point of being measurably LESS than HDDs.  The Mosaid press release is available here.




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    While it’s apples-and-oranges, the Samsung 830 512GB uses octal-die (as in 8) packages with 64gbit dice, giving a total capacity per package of 64gb, or 512gbits. The big deal here is the bus architecture which can help overcome the issues of putting more dice in one package. Most likely, this would be far more helpful in mobile devices where there isn’t enough room to place a large number of packages.

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