Biwin Announces e-MMC SSD-on-a-Chip for Embedded Computing Applications
SAN JOSE, Calif. “ April 17, 2012 “ Embedded computing OEMs are seeking ways to shorten their design cycles and save precious space inside their systems. Biwin, an industry leader in flash storage products, today announced an e-MMC SSD in a 169-ball BGA chip that addresses both those demands, enabling customers to design in a complete storage solution on a single chip with an industry standard interface.
Biwins new e-MMC SSDs are offered in capacities from 2GB to 64GB. They integrate both flash and a full SSD controller into a single chip, featuring advanced SSD features such as ECC, wear leveling and bad block management. They also include two key new features for embedded memory applications: power-on boot and explicit sleep mode, which translate to significant benefits for the end-user. Power-on boot defines a way for the boot-code to be accessed by the host controller without an upper-level software driver, speeding the time it takes for a controller to access the boot code. Explicit sleep mode enables the host controller to directly instruct e-MMC to enter power-saving sleep mode – an enhancement that has an immediate positive impact on power efficiency. These JEDEC compatible, e-MMC v4.4 compliant SSDs are ideal for use in a plethora of mobile gadgets requiring a ready-made storage solution.
These e-MMC SSDs leverage Biwins core strengths in chip packaging and SSD design, and are produced in Biwins own factory. SSD-on-a-chip technology will help embedded customers shorten their design cycles and get to market faster with new products, while offering a reliable long-range storage solution.
– Joe James, Vice President of Worldwide Marketing, Biwin America