Kingston HyperX T1 DDR3-1600 CL9 – Specifications

The Kingston HyperX T1 Series of RAM is a typical 1600 MHz kit, however several XMP profiles are available with easy setup for the home user.  Depending on the configuration of ones computer, any of these four generic settings can be used as highlighted in our CPU-Z screenshot below:

This next shot will display the speed at which we are testing this kit:


Kingston’s KHX1600C9D3T1BK3/12GX is a kit of three 512M x 64-bit (4GB) DDR3-1600MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 12GB. Each module kit has been tested to run at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

  • JEDEC standard 1.5V± 0.075V Power Supply
  • VDDQ = 1.5V± 0.075V
  • 667MHz fCK for 1333Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 5,6,7,8,9,10
  • Posted CAS
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD= 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
  • Asynchronous Reset
  • PCB : Height 2.401 (61.00mm) w/ heatsink, double sided component


  • CL(IDD) 9 cycles
  • Row Cycle Time (tRCmin) 49.5ns (min.)
  • Refresh to Active/Refresh Command Time (tRFCmin) 160ns
  • Row Active Time (tRASmin) 36ns (min.)
  • Power 2.225 W (operating per module)
  • UL Rating 94 V – 0
  • Operating Temperature 0o C to 85o C
  • Storage Temperature -55o C to +100o C


With its large heat dissipating surface, the new T1 heat sink delivers even better heat dispersion efficiency. This kit will provide better cooling regardless of your cooling method (i.e. convection or cooling by means of a dedicated fan). For systems that are required to run at full speed over prolonged periods of time, the T1 heat sink makes an excellent component for improved performance.

Pg1 – Introduction and Packaging

Pg2 – Specifications

Pg3 – Benchmarks

Pg4 – AIDA64 and Conclusions


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