Search Results for: Flash Memory Summit

KIOXIA Announces XG7/XG7-P PCIe 4.0 SSDs for High-end Client Applications

KIOXIA is announcing the release of their new XG7/XG7-P Series of PC OEM-focused SSDs, updating their portfolio of PCIe 4.0 client SSDs for desktops, notebooks and workstations. KIOXIA’s comprehensive product offerings now span enterprise, data center and client segments, addressing a wide array of usage scenarios and optimizing tomorrow’s data, service and content-driven environment. Designed for demanding PC environments, the …

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Toshiba Introduces XFMEXPRESS™ – A New Form Factor, Innovative Connector, and Mobile-Friendly Footprint

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Toshiba Memory America is utilizing Flash Memory Summit 2019 to introduce their new XFMEXPRESS™ Technology for removable PCIe attached, NVMe memory devices. XFMEXPRESS features a new form factor and a new innovative latching connector that greatly enhances serviceability and upgrade opportunities. Toshiba utilized their extensive background in single-package memory designs to develop XFMEXPRESS, with features that are designed to revolutionize …

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Microsemi Announces New Adaptec SmartRAID Storage Adapter Solutions — Now Including Integrated On-Board Cache Protection and Support For maxCrypto™ Secure Encryption

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Microsemi, recently acquired by Microchip Technology Inc., is announcing two new additions to its line of Adaptec Smart Storage 12Gbps SAS/SATA adapters.  The SmartRAID 3162-8i now includes integrated on-board cache protection via a super capacitor mounted directly to the adapter, supporting write-cache data protection.  The 3162-8i/e debuts as the industry’s first off-the-shelf 12Gbps SAS/SATA RAID adapter with maxCrypto™, which is …

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Toshiba Announces XG6 NVMe SSD – Industry’s First SSD Utilizing 96-Layer 3D NAND

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Toshiba Memory is announcing a new series of solid-state drives (SSDs) that utilize Toshiba’s new 96-layer, BiCS FLASH™ 3D NAND.  The new XG6 series are the first to use this breakthrough technology, and are geared toward client PC, high-performance mobile computing, gaming and embedded usage applications.  The XG6 series are also a good fit for data center applications, including as …

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Intel Announces New 3D NAND Data Center SSDs

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As the world’s stockpile of data continues to grow, Intel continues to bring to market industry-leading storage and memory products, pushing both form factor innovation and ever-increasing capacity.  Intel’s latest data center offerings, the SSD DC P4510 and P4511 series, are reimagining how data is store for data centers.  With the creation of interesting new form factors, such as the …

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Maxiotek Begins Mass Production of Their MK8115 DRAM-less SSD Controller Supporting 3D NAND

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Back in August of this year our Sean Webster was at Flash Memory Summit 2016, and had the opportunity to visit the Maxiotek display (view our coverage here).  On display was their new MK8115 DRAM-less SSD controller that supports 3D MLC and 3D TLC NAND.  The new Maxiotek controller has reportedly been widely adopted by numerous major SSD brands, resulting …

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Maxiotek Announces Their MK8115, The First-Ever 3D-NAND-supported DRAM-less SSD Controller Solution

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Maxiotek Corporation, a new player in the fabless SSD Controller IC design house arena, is announcing release of their MK8115, heralded as the first-ever 3D-NAND-supported DARM-less SSD controller solution, geared toward the growing market for SSDs with superior performance at an excellent value point. MK8115’s DRAM-less design allows customers greater freedom in PCB designs, as the PCB space normally allocated …

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Everspin Announces Sampling of Industry’s First 256Mb Perpendicular Spin Torque MRAM to Customers

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Everspin Technologies, the leading producer of MRAM technology and devices, is announcing that they have begun shipping the world’s first product utilizing perpendicular Magnetic Tunnel Junction (pMTJ)-based ST-MRAM  to customers.  Their 256Mb DDR3 product is the highest density commercially available perpendicular ST-MRAM in the market. Everspin’s successes now extend to its third generation MRAM technology, and they are preparing for …

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Microsemi Provides the Industry’s Highest Density, Lowest Power PCIe Switch

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Microsemi, has announced today that they are now offering a new PCIe Gen3 Switch, its Switchtec PFX PCIe switch. The Switchtec PFX PCIe switch provides for the the industry’s highest density and lowest power for data center, defense, communications, and industrial applications. These new switches enable PCIe solutions in a variety of systems from general purpose applications requiring low power and high-reliability PCIe …

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Zstor Announces NV-Series – NVMe Over Fabric Storage Array For Ultra-Low Latency

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Zstor, a Germany-based leading producer of high-performance storage offerings for compute-intensive applications, is announcing its newest flagship storage solution family based on the latest NVMe specification.  Zstor’s new NV-Series is developed in conjunction with Mangstor Inc., and uses Ethernet or Infiniband Remote Direct Memory Access (RDMA) networks to take advantage of the low latency benefits of the NVMe standard.  This …

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