Breaking News

Search Results for: Flash Memory Summit

Toshiba Announces XG6 NVMe SSD – Industry’s First SSD Utilizing 96-Layer 3D NAND

Toshiba Memory is announcing a new series of solid-state drives (SSDs) that utilize Toshiba’s new 96-layer, BiCS FLASH™ 3D NAND.  The new XG6 series are the first to use this breakthrough technology, and are geared toward client PC, high-performance mobile computing, gaming and embedded usage applications.  The XG6 series are also a good fit for data center applications, including as …

Read More »

Intel Announces New 3D NAND Data Center SSDs

As the world’s stockpile of data continues to grow, Intel continues to bring to market industry-leading storage and memory products, pushing both form factor innovation and ever-increasing capacity.  Intel’s latest data center offerings, the SSD DC P4510 and P4511 series, are reimagining how data is store for data centers.  With the creation of interesting new form factors, such as the …

Read More »

Maxiotek Begins Mass Production of Their MK8115 DRAM-less SSD Controller Supporting 3D NAND

Back in August of this year our Sean Webster was at Flash Memory Summit 2016, and had the opportunity to visit the Maxiotek display (view our coverage here).  On display was their new MK8115 DRAM-less SSD controller that supports 3D MLC and 3D TLC NAND.  The new Maxiotek controller has reportedly been widely adopted by numerous major SSD brands, resulting …

Read More »

Maxiotek Announces Their MK8115, The First-Ever 3D-NAND-supported DRAM-less SSD Controller Solution

Maxiotek Corporation, a new player in the fabless SSD Controller IC design house arena, is announcing release of their MK8115, heralded as the first-ever 3D-NAND-supported DARM-less SSD controller solution, geared toward the growing market for SSDs with superior performance at an excellent value point. MK8115’s DRAM-less design allows customers greater freedom in PCB designs, as the PCB space normally allocated …

Read More »

Everspin Announces Sampling of Industry’s First 256Mb Perpendicular Spin Torque MRAM to Customers

Everspin Technologies, the leading producer of MRAM technology and devices, is announcing that they have begun shipping the world’s first product utilizing perpendicular Magnetic Tunnel Junction (pMTJ)-based ST-MRAM  to customers.  Their 256Mb DDR3 product is the highest density commercially available perpendicular ST-MRAM in the market. Everspin’s successes now extend to its third generation MRAM technology, and they are preparing for …

Read More »

Microsemi Provides the Industry’s Highest Density, Lowest Power PCIe Switch

Microsemi, has announced today that they are now offering a new PCIe Gen3 Switch, its Switchtec PFX PCIe switch. The Switchtec PFX PCIe switch provides for the the industry’s highest density and lowest power for data center, defense, communications, and industrial applications. These new switches enable PCIe solutions in a variety of systems from general purpose applications requiring low power and high-reliability PCIe …

Read More »

Zstor Announces NV-Series – NVMe Over Fabric Storage Array For Ultra-Low Latency

Zstor, a Germany-based leading producer of high-performance storage offerings for compute-intensive applications, is announcing its newest flagship storage solution family based on the latest NVMe specification.  Zstor’s new NV-Series is developed in conjunction with Mangstor Inc., and uses Ethernet or Infiniband Remote Direct Memory Access (RDMA) networks to take advantage of the low latency benefits of the NVMe standard.  This …

Read More »

Novachips Announces Scalar-Series of Solid-State Drives – First 4TB/8TB SATA/NVMe SSDs in 2.5” Form Factor

Novachips Co., Ltd, an innovative producer of flash storage solutions, is announcing the Scalar-Series of solid-state drives (SSDs), representing the first 4TB SSD in a 2.5” x 7mm form factor, and the first 8TB SSD in a 2.5” x 15mm form factor. The Scalar-Series of SSDs are based on a SATA 3.1 (6Gb/s) interface, and deliver sequential read speeds of …

Read More »