Tag Archives: Toshiba

Toshiba Announces XG6 NVMe SSD – Industry’s First SSD Utilizing 96-Layer 3D NAND

Toshiba Memory is announcing a new series of solid-state drives (SSDs) that utilize Toshiba’s new 96-layer, BiCS FLASH™ 3D NAND.  The new XG6 series are the first to use this breakthrough technology, and are geared toward client PC, high-performance mobile computing, gaming and embedded usage applications.  The XG6 series are also a good fit for data center applications, including as …

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Toshiba Announces KumoScale Storage Software for Cloud Applications

Toshiba is utilizing the 2018 Open Compute Project (OCP) U.S. Summit to announce general availability of their new KumoScale™ storage software for cloud applications.  This new NVMe-oF™ (NVM Express™ over Fabrics) shared accelerated storage software enables the use of NVMe-oF to make flash storage accessible over a data center network, providing a simplified, flexible abstraction of physical disks into a …

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Toshiba Announces New Data Center SSDs Featuring BiCS FLASH™ 64-Layer 3D NAND

Toshiba Memory America is announcing expansion of its portfolio of SSDs for data centers with the addition of new PCIe NVMe and SATA SSDs that feature Toshiba BiCS FLASH 64-layer TLC 3D NAND in several form factors.  Their new CD5, XD5 and HK6-DC SSDs provide robust performance and reliability for read-intensive usage scenarios such as streaming media, big data analytics …

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Toshiba Announces RC100 Mainstream NVMe M.2 SSD — CES 2018 Update

Toshiba Memory Corporation is starting off its CES 2018 presence by announcing its latest NVMe M.2 SSD, designated as the RC100 Series.  This new SSD offering from Toshiba is geared toward mainstream users, including retail, system integrators and channel markets.  The RC100 Series features Toshiba’s own 64-layer, 3-bits-per-cell TLC (triple-level cell) BiCS FLASH™ combined with an in-house developed controller in …

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Toshiba Memory America Begins Sampling New Automotive UFS Embedded Memory Solutions

Toshiba Memory America is announcing that they have begun sampling of their new Automotive UFS embedded memory devices that support JEDEC specification ver. 2.1 HS-G3.  This latest automotive UFS memory joins TMA’s Automotive e-MMC family of products to diversify their automotive product offerings.  As the widespread adoption of entertainment and information systems continues, the market for applicable memory devices also …

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Toshiba Announces XG5-P 2TB NVMe SSD – Enhanced Performance and Capacity Over Standard XG5 Series

Toshiba Memory Corporation is announcing its latest addition to its client SSD lineup with the XG5-P 2TB NVMe model.  This premium addition to the XG5 series features improved performance as well as doubling the maximum capacity to 2TB. The XG5-P series of SSDs will also be offered in self-encrypting drive (SED) models that support TCG Opal Version 2.01, making it …

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