Tag Archives: Flash Memory Summit 2019

Toshiba Introduces XFMEXPRESS™ – A New Form Factor, Innovative Connector, and Mobile-Friendly Footprint

Toshiba Memory America is utilizing Flash Memory Summit 2019 to introduce their new XFMEXPRESS™ Technology for removable PCIe attached, NVMe memory devices. XFMEXPRESS features a new form factor and a new innovative latching connector that greatly enhances serviceability and upgrade opportunities. Toshiba utilized their extensive background in single-package memory designs to develop XFMEXPRESS, with features that are designed to revolutionize …

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