Tag Archives: BiCS FLASH

Toshiba Announces BG4 1TB Single Package PCIe Gen3 x4L SSDs Featuring 96-Layer BiCS FLASH™ 3D Memory — CES 2019 Update

Welcome to our 2019 coverage of the ever-impressive Consumer Electronics Show in Las Vegas.  The first news to hit the pipeline is Toshiba announcing their BG4 series of ball grid array (BGA) solid-state drive (SSD).  Toshiba’s ultra-compact NVMe™ SSDs pair both the flash and an all-new controller into a single package, creating design flexibility that is ideal for ultra-thin PC …

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Toshiba Announces XG6 NVMe SSD – Industry’s First SSD Utilizing 96-Layer 3D NAND

Toshiba Memory is announcing a new series of solid-state drives (SSDs) that utilize Toshiba’s new 96-layer, BiCS FLASH™ 3D NAND.  The new XG6 series are the first to use this breakthrough technology, and are geared toward client PC, high-performance mobile computing, gaming and embedded usage applications.  The XG6 series are also a good fit for data center applications, including as …

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Toshiba Announces New Data Center SSDs Featuring BiCS FLASH™ 64-Layer 3D NAND

Toshiba Memory America is announcing expansion of its portfolio of SSDs for data centers with the addition of new PCIe NVMe and SATA SSDs that feature Toshiba BiCS FLASH 64-layer TLC 3D NAND in several form factors.  Their new CD5, XD5 and HK6-DC SSDs provide robust performance and reliability for read-intensive usage scenarios such as streaming media, big data analytics …

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Toshiba Announces XG5 NVMe SSD — Industry’s First 64-Layer BiCS 3D Memory SSD

Toshiba is announcing the XG5 M.2 NVMe SSD, representing the industry’s first SSD to ship with 64-layer BiCS FLASH­­­™ 3D memory.  First demonstrated at Dell/EMC World, the XG5 is geared toward mainstream computing, thin performance notebooks, and enthusiast desktops and laptops. Utilizing Toshiba’s BiCS FLASH­™ 3D flash memory and its vertically stacked cell structure allows for higher capacity in the …

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Toshiba Building New Fab Facility at Yokkaichi (Japan) to Expand 3D Flash Memory Production Capacity

Toshiba is announcing their outline schedule for constructing a new state-of-the-art fabrication facility at their Yakkaichi Operations in Mie, Japan.  The new fab will be geared toward expanding production of Toshiba’s proprietary 3D Flash memory, also known as BiCS FLASH™. Toshiba had announced their intention to build a new BiCS FLASH™ facility back in March of this year, and they …

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Toshiba Announces New BG SSDs With TLC BiCS Flash In World’s Smallest Form Factor

Toshiba America Electronic Components, Inc., a world-leading producer of storage technology and devices, is announcing that it will be showcasing its new BG series of solid-state drives (SSDs) featuring cutting-edge BiCS FLASH™ with TLC technology and Toshiba’s new single-package ball grid array (BGA) NVMe PCIe Gen3 x2 SSD at the 2016 Flash Memory Summit in Santa Clara, CA from 8/8 …

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