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SK Hynix Announces Industry’s First 72-Layer 3D TLC NAND

SK Hynix 72-layer 3D NAND feature

SK Hynix is announcing development of the industry’s first 72-layer 3D TLC NAND in 256Gb density.  Each 256Gb NAND flash chip represents 32GB of storage.  SK Hynix launched their 36-layer (128Gb) NAND chips in April of 2016, followed by mass production of 48-layer (256Gb) 3D NAND chips beginning in November of 2016.  A mere 5 months later, SK Hynix is …

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