The SuperTalent upStream is a typical PCIe SSD printed circuit board which contains four LSI SandForce SF-1222 processors. Our review sample contains 32 pieces of 25nm Micron asynchronous NAND flash memory (29F64G08CBAAA) with each being 8GB in size. Coincidentally, the memory is separated into two groups of eight pieces on each side of the card with specific reasoning.
The RAIDDrive upStream is actually four 64GB over-provisioned SSDs that are set up in a RAID 0 configuration as a 220GB volume with amazing performance. Simply consider that one SF-1222 processor controls a block of eight memory modules. From there, the four SSDs are routed through the LSI SAS 1064E RAID Controller which outputs a volume of 220GB with performance at just under 1GB. This is possible only because we are using the PCIe lane which does not have SATA 2 restrictions (remember SF-1222) as a normal SSD would being connected through a SATA 2 interface.
Also located on the PCB which is unique to PCIe SSDs, at least at this point, is a Spansion 16M S29AL016J70TF102 Boot Sector Flash Module which enables your system to boot from the card itself. As remarkable as it seems, our system recognized the card immediately and installation of the OS was a snap.
Last but not least, we have two Enperion EN6360Q1 PowerSOCs (Power System On A Chip) to regulate power to the card and protect it with such things as thermal shutdown, over current, short circuit, and under-voltage protection.
LSI SAS1064E RAID CONTROLLER
Rather unique is also the fact that this card is one of the first to highlight the acquisition of SandForce by LSI in the cards joining of the LSI SAS1064E RAID Controller along with 4 x SF-1222 processors. Similar has also been seen in LSIs own WarpDrive where we saw the LSI SAS2008 controller paired with SandForce SF-1500 processors but we don’t know of any other manufacturers, outside of LSI, pulling this off prior to the upStream.
The SAS1064E is hidden below a black heatsink and clipped in place by a blue retainer. The heatsink was extremely difficult to separate from the chip because of the thermal compound which was most likely some sort of a thermal superglue, it’s purpose of course being to move the heat of the chip to the heatsink where it can dissipate by airflow passing through the fins.