INSIDE THE BOX
Now we pull the heatsink and the ‘goodies’ out to see what we have to work with. Here we have semi-assembled the back plate with the screws and bolts (bottom center) to illustrate the back plate configuration. There is a separate bag for the Socket 2011 bolts, and instructions. The other two bags are for AMD and Intel components. Also included is a handy tube of Thermal Grease TIM. In order to present the review in the light that the kit is intended to function, we did use this TIM for the installation.
There is also an included fan, and this is the key to any noise targets. This 120MM fan is indeed very quiet, partly due to 3rd generation fluid dynamic bearings. The sub-1600 RPM fan does provide some surprising performance at 32-86 CFM, and an impressive 8-24 DBA. This fan can also be substituted for more powerful fans, if the need arises. There is also mounting equipment for another fan to be mounted to the rear of the heatsink for a push/pull configuration.
One thing that jumps right out at us is the exposed 6mm heatpipes on the CPU connection surface. This is an important consideration as this allows direct heat transfer from the heatpipes to the fins above. A vast array of coolers out there that do not utilize this technology, which is unfortunate. These types of coolers usually offer the very best performance.
A very innovative approach for maximum performance that has been taken is in the design of the top of the contact surface itself. These metal protrusions will allow for extra heat transfer from the base of the cooler to maximize cooling potential. This is a very unique approach and definitely benefits the user with that extra bit of heat transfer that can shave off a few extra degrees.
Another of the keys to the great performance is the “wavy” appearance of the frontal configuration of the fins. This provides the airflow the least amount of turbulence at the most important point, when the air is actually flowing into the device. Coolers with straight lines of fins actually develop air turbulence at the front of the fins, which considerably alters the airflow into the fin area. This is an emerging technique in cooler technology that has provided great performance benefits.
Yet another key consideration that we can observe from the picture below is the ‘pockmarked’ appearance of the fins themselves. There are in fact divots that are manufactured into the surface of every single fin.
This technique is much like the dimples that you can observe on a typical golf ball. These small dimples in the surface actually create less resistance for the air that is traveling over the surface, thus speeding up the airflow and lowering turbulence as the air travels through the fin area.